Liquid Nitrogen Piping - Semiconductor Back End Testing

Download PDF

CHALLENGE

  • Efficient supply of LN2 from bulk tank
  • Readily available supply of LN2 at use point
  • Clean & frost free operation in all conditions

SOLUTION

Part of the back-end semiconductor manufacturing process involves putting individual chips through environmental testing. Often, liquid nitrogen is required to perform cold-shock and cold cycle tests at dozens of use points. Vacuum jacketed piping and the use of vapor vents ensure a constant supply of LN2 is maintained at multiple use points, with minimal losses. Due to the extreme cleanliness requirements in the semiconductor industry, liquid nitrogen piping must operate completely frost & moisture free under all conditions. Bayonet joints are designed to limit heat loss, and end traps allow frost free operation at use points, even while LN2 is readily available.

HOW IT WORKS

  • Modular piping and connections allow distribution to multiple use points, and possibility of re-configuration
  • Vapor vents help maintain liquid availability at use points
  • Vacuum jacketing across bayonet connections and components increase efficiency and clean operation
  • End traps provide frost-free connection points even when liquid is present

ADVANTAGES

  • Clean, frost free cooling to extremely low temperatures
  • Variety of internal diameter piping to accommodate a range of flow rates
  • Modular and re-configurable
  • Years of experience as cryogenic experts