Liquid Nitrogen Piping - Semiconductor Back End Testing
Part of the back-end semiconductor manufacturing process involves putting individual chips through environmental testing. Often, liquid nitrogen is required to perform cold-shock and cold cycle tests at dozens of use points. Vacuum jacketed piping and the use of vapor vents ensure a constant supply of LN2 is maintained at multiple use points, with minimal losses. Due to the extreme cleanliness requirements in the semiconductor industry, liquid nitrogen piping must operate completely frost & moisture free under all conditions. Bayonet joints are designed to limit heat loss, and end traps allow frost free operation at use points, even while LN2 is readily available.